IDENTIFICATION AND CHARACTERIZATION OF HEAT SHOCK PROTEIN (HSP) GENES IN Gossypium barbadense

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Published: 2021-02-01

Page: 65-76


MOHAMED ALZALATY *

Agricultural Genetic Engineering Research Institute, Agricultural Research Center, Egypt

AMAL A. HAMED

Botany and Microbiology Department, Faculty of Science, Cairo University, Egypt

AMAAL MAGHRABY

Botany and Microbiology Department, Faculty of Science, Cairo University, Egypt

*Author to whom correspondence should be addressed.


Abstract

Tolerance to high temperature in cotton is a complex traits which controlled by multiple genes that working in combination to avoid or to resist high temperature. Genotype independent may show quantitative and qualitative differences in gene expression when treated to high temperature. In plants, Heat Shock Protein plays many roles in stages of development, plant growth, and regulation of multiple pathways in higher plant which are responsible for abiotic stresses tolerance. In this study, were designed specific primers to isolate and identify some genes that responsible for tolerance of high temperature in Gossypium barbadense. Four heat shock protein (HSP) genes Hsp21, Hsp26, Hsp23 and Hsp36 were isolated, sequenced and identified. Search of databases showed that the four fragments identify for four genes that have high homology in Gossypium sp. and related to heat treatment. Multiple Sequence Alignment and comparative mapping showed the relationship between sequences and function that give explanation of mechanism of adaption which related by genotype. Understand of tolerant mechanism and its gene function allows improving of cotton tolerance to high temperature by means of genetic manipulation and molecular breeding.

Keywords: Abiotic stress, biological databases, comparative genomics, bioinformatics.


How to Cite

ALZALATY, MOHAMED, AMAL A. HAMED, and AMAAL MAGHRABY. 2021. “IDENTIFICATION AND CHARACTERIZATION OF HEAT SHOCK PROTEIN (HSP) GENES IN Gossypium Barbadense”. PLANT CELL BIOTECHNOLOGY AND MOLECULAR BIOLOGY 22 (3-4):65-76. https://ikprress.org/index.php/PCBMB/article/view/5856.

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